Study on Non-Cyanide Silver Electroplating With Copper Substrate

被引：3

作者：

Chen, Lu ^{[1
]}

Jing, Hongyang ^{[1
]}

Xu, Lianyong ^{[1
]}

Lu, Guoquan ^{[2
]}

机构：

[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China

[2] Virginia Polytech Inst & State Univ, Sch Mat Sci & Engn, Blacksburg, VA 24061 USA

来源：

ADVANCED MANUFACTURING TECHNOLOGY, PTS 1-4 | 2012年 / 472-475卷

关键词：

Non-cyanide electroplating; Silver; Silver concentration; Copper substrate;

D O I：

10.4028/www.scientific.net/AMR.472-475.2936

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The non-cyanide silver electroplating on copper substrate has been discussed. Based on the surface morphology by using SEM, the smooth and fine silver layer is obtained. The influences of concentration of silver and plating temperature on the thickness of the plating layer are discussed, the thickness of the silver layer is increasing with silver concentration rising and plating temperature rising.

引用

页码：2936 / +

页数：2

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