共 50 条
- [41] Signaling Scheme for High Speed Die-to-Die Interconnection in Multi-Chip Package (MCP) Technology PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 173 - 177
- [42] Die Meinung: Lasst die Konjunktur die Bauwirtschaft zurueck? Bauwirtschaft - BW, 2000, 54 (03):
- [44] Effect of die shape on die tilt in die attach process 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 651 - +
- [48] Die to die and die to database capability analysis for advanced OPC inspection 19TH ANNUAL SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PTS 1 AND 2, 1999, 3873 : 626 - 634