Analysis and Selection of insulating material based on 3D Printing PCB board

被引：0
|
作者：
Bai Lei [1 ]
Sun Changjian [1 ]
Zhang Zhiyi [1 ]
机构：
[1] Beihua Univ, Jilin 132021, Jilin, Peoples R China
来源：
2018 7TH INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND COMPUTER SCIENCE (ICAMCS 2018) | 2019年
关键词：
Three dimensional printing; PCB manufacturing; insulation layer; electronic encapsulation;
D O I：
10.23977/icamcs.2018.068
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
The traditional PCB plate makes process and adopts "reduction". The combination of art and technology has created a new "added material manufacturing" theory. There is important research value. The paper takes electrons, potting adhesive as insulation material of PCB circuit board. Printing tests for various types of potting compound which is carried out. The result of comparative data is obtained. Finally on the photo paper, the electronic circuit seal layer is completed as well as insulation performance test is conducted.
引用
收藏
页码：357 / 361
页数：5
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