Mechanical properties analysis of polyimide insulating layer for the multilayer circuit boards based on 3D printing technology

In this article, we explore the mechanical properties analysis of polyimide insulators for inkjet printing process, while we analyze the mechanical properties of four layer and four channel power management PCB model that the insulating layers are made of polyimide insulators. Firstly, we extract the shear modulus of specific polyimide insulators by Material Studio software. According to PCB deformation standard IPC-610D, we set the boundary conditions for the plate deformation is less than or equal to 0.75%, and then, we use ANSYS software to analyze stress-strain of the polyimide insulators in a particular thermal environment. Next, we get the Stress-strain parameters to check maximum shear strength of insulating materials under boundary conditions. By checking the maximum shear strength, we find the Hili Shear modulus of the polyimide insulators is 1.38GPa, and it can withstand the maximum shear strength is 10.35Mpa, and the maximum shear strength of the polyimide insulators is 10.5Mpa, suggesting that the insulating layers is an efficient way for this PCB model. Finally, by changing the physical properties of this material, and getting the Stress-strain parameters by ANSYS software, the results of analyze show that The Young's modulus of the material has the greatest effect on the internal stress. This paper provides reliable reference for use as an insulating polyimide printing material in multilayer circuit boards.