Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging

被引：3
|
作者：
Cotts, Eric [1 ]
Arfaei, Babak [1 ,2 ]
机构：
[1] SUNY Binghamton, Dept Phys, Binghamton, NY 13902 USA
[2] APL Lab, Universal Instruments, Conklin, NY 13748 USA
来源：
JOM | 2015年 / 67卷 / 10期
关键词：
D O I：
10.1007/s11837-015-1597-z
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：2381 / 2382
页数：2
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