Thermal Design of a LED Multi-chip Module for Automotive Headlights

被引：0
|
作者：
Qi Lin [1 ]
Wang Chunqing [1 ]
Tian Yanhong [1 ]
机构：
[1] Harbin Inst Technol, Natl Key Lab Adv Welding Prod Technol, 92 West Dazhi St, Harbin 150001, Heilongjiang, Peoples R China
来源：
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a LED multi-chip module with a heat pipe was designed for automotive headlights, which took advantages of the relative air flow during vehicle travelling for forced convection to keep the junction temperature of LED chips below 60 degrees C. The Structure is compact enough to be suitable for placement in a small space for automotive lighting. The influence of paraments on the junction temperature of LED chips, such as the distance of LED arrangement and dimensions of both DBC substrates and sinks, has also been discussed by numerical simulation using ANSYS software. Then, the structure of the module was optimized. The junction temperature was measured using the forward voltage method, under the condition of both natural convection and forced convection. It was analyzed that the factors having an effect on thermal performance of the module. Furthermore, taking the condition of natural air convection during vehicle stopping into account, a temperature control system was designed for this module.
引用
收藏
页码：1435 / 1438
页数：4
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