Spacer-Is-Dielectric-Compliant Detailed Routing for Self-Aligned Double Patterning Lithography

被引:0
|
作者
Du, Yuelin [1 ]
Ma, Qiang
Song, Hua
Shiely, James
Luk-Pat, Gerard
Miloslavsky, Alexander
Wong, Martin D. F. [1 ]
机构
[1] Univ Illinois, Dept ECE, Urbana, IL 61801 USA
关键词
SADP; SID-CompliantDetailedRouting;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in design. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conflict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.
引用
收藏
页数:6
相关论文
共 50 条
  • [41] DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning
    Montal, Ofir
    Dotan, Kfir
    Mebarki, Bencherki
    Cai, Man-ping
    Ngai, Chris
    SOLID STATE TECHNOLOGY, 2010, 53 (07) : 16 - 18
  • [42] Integrated Routing and Fill for Self-Aligned Double Patterning (SADP) Using Grid-Based Design
    Song, Youngsoo
    Lee, Jeemyung
    Lee, Seongmin
    Shin, Youngsoo
    DESIGN-PROCESS-TECHNOLOGY CO-OPTIMIZATION FOR MANUFACTURABILITY X, 2016, 9781
  • [43] Simulation of spacer-based SADP (Self-Aligned Double Patterning) for 15nm half pitch
    Robertson, Stewart
    Wong, Patrick
    Versluijs, Janko
    Wiaux, Vincent
    OPTICAL MICROLITHOGRAPHY XXVI, 2013, 8683
  • [44] Double Patterning Lithography Aware Gridless Detailed Routing with Innovative Conflict Graph
    Lin, Yen-Hung
    Li, Yih-Lang
    PROCEEDINGS OF THE 47TH DESIGN AUTOMATION CONFERENCE, 2010, : 398 - 403
  • [45] Self-Aligned Block and Fully Self-Aligned Via for iN5 Metal 2 Self-Aligned Quadruple Patterning
    Vincent, Benjamin
    Franke, Joern-Holger
    Juncker, Aurelie
    Lazzarino, Frederic
    Murdoch, Gayle
    Halder, Sandip
    Ervin, Joseph
    EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY IX, 2018, 10583
  • [46] Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
    Raley, Angelique
    Lee, Joe
    Smith, Jeffrey T.
    Sun, Xinghua
    Farrell, Richard A.
    Shearer, Jeffrey
    Xu, Yongan
    Ko, Akiteru
    Metz, Andrew W.
    Biolsi, Peter
    Devilliers, Anton
    Arnold, John
    Felix, Nelson
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2019, 18 (01):
  • [47] Self-Aligned Blocking Integration Demonstration for Critical sub 30nm pitch Mx Level Patterning with EUV self-aligned double patterning
    Raley, Angelique
    Lee, Joe
    Smith, Jeffrey T.
    Sun, Xinghua
    Farrell, Richard A.
    Shearer, Jeffrey
    Xu, Yongan
    Ko, Akiteru
    Metz, Andrew W.
    Biolsi, Peter
    Devilliers, Anton
    Arnold, John
    Felix, Nelson
    ADVANCED ETCH TECHNOLOGY FOR NANOPATTERNING VII, 2018, 10589
  • [48] Litho-Friendly Decomposition Method for Self-Aligned Double Patterning
    Mirsaeedi, Minoo
    Torres, Andres J.
    Anis, Mohab H.
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2013, 21 (08) : 1469 - 1480
  • [49] SELF-ALIGNED DUAL SURFACE LITHOGRAPHY
    KRUSIUS, JP
    NULMAN, J
    PERERA, A
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1986, 4 (01): : 369 - 374
  • [50] Cut Optimization for Redundant Via Insertion in Self-Aligned Double Patterning
    Song, Youngsoo
    Hyun, Daijoon
    Lee, Jingon
    Jung, Jinwook
    Shin, Youngsoo
    ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS, 2019, 24 (06)