Vernier SI/PI Co-simulation

被引：0
|
作者：
Norman, Adam J. [1 ]
机构：
[1] Intel Corp, PC Client Grp, Hillsboro, OR 97124 USA
来源：
2013 17TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI) | 2013年
关键词：
SI/PI; co-simulation; BER; HVM; interconnect;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The majority of time and effort spent to analyze and design a PC interconnect is not well served by commercial SI/PI tools. This paper examines those usage models and suggests improvements that would result in higher adoption rates of commercial SI/PI tools.
引用
收藏
页数：4
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