Effect of interfacial thermal mismatch on interfacial strength of composites

被引：0
|
作者：
Liu, RY
Wang, LS
Zhang, JS
Fan, Y
机构：
[1] INST AERONAUT MAT,BEIJING 100095,PEOPLES R CHINA
[2] CENT S UNIV TECHNOL,RES INST POWDER MET,CHANGSHA 410083,PEOPLES R CHINA
来源：
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 1997年 / 7卷 / 03期
关键词：
composite; interfacial thermal mismatch; interfacial strength;
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
By means of diamond microdebonding test method and the interfacial stress field finite element analysis(FE), the influence of interfacial thermal expansion mismatch between fiber and matrix on the interfacial strength was investigated. The results show that, the radial thermal mismatch has played a dominant role, with the influence of the axial thermal mismatch being relatively small. Furthermore, the interfacial thermal residual stress was also studied.
引用
收藏
页码：75 / 79
页数：5
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