Crack growth analysis at adhesive-adherent interface in bonded joints under mixed mode I/II

被引：19
|
作者：
Marannano, G. V. [1 ]
Mistretta, L. [1 ]
Cirello, A. [1 ]
Pasta, S. [1 ]
机构：
[1] Univ Palermo, Dept Mech, I-90128 Palermo, Italy
来源：
ENGINEERING FRACTURE MECHANICS | 2008年 / 75卷 / 18期
关键词：
Adhesive joint; Interface crack; MMELS specimen; Virtual crack closure technique; Crack growth;
D O I：
10.1016/j.engfracmech.2008.07.010
中图分类号：
O3 [力学];
学科分类号：
08 ; 0801 ;
摘要：
The propagation of an interface crack subjected to mixed mode I/II was investigated for two 2024-T351 aluminum thin layers joined by means of DP760 epoxy adhesive produced by 3M (c). On the basis of beam theory, an analytical expression for computing the energy release rate is presented for the mixed-mode end loaded split (MMELS) test. The analytical strain energy release rate was compared by finite element (FE) analysis using the virtual crack closure technique (VCCF). Several fatigue crack growth tests were carried out in a plane bending machine to compare the experimental energy release rates to those of the analytical and FE solutions. Experimental results showed the relationship between the delamination modality and initial crack length rather than the applied load. The crack growth behavior showed stable crack growth followed by rapid propagation at the interface with the adhesive layer. (c) 2008 Elsevier Ltd. All rights reserved.
引用
收藏
页码：5122 / 5133
页数：12
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