STRESS SINGULARITY ANALYSIS OF MULTI-MATERIAL WEDGES UNDER ANTIPLANE DEFORMATION

被引:4
|
作者
Hu, Xiaofei [1 ]
Yao, Weian [1 ]
机构
[1] Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China
基金
中国国家自然科学基金;
关键词
analytical method; eigenvalues; interface; crack; symplectic space; CRACK; BIMATERIAL; FIELD;
D O I
10.1016/S0894-9166(13)60015-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
With the help of the coordinate transformation technique, the symplectic dual solving system is developed for multi-material wedges under antiplane deformation. A virtue of present method is that the compatibility conditions at interfaces of a multi-material wedge are expressed directly by the dual variables, therefore the governing equation of eigenvalue can be derived easily even with the increase of the material number. Then, stress singularity on multi-material wedges under antiplane deformation is investigated, and some solutions can be presented to show the validity of the method. Simultaneously, an interesting phenomenon is found and proved strictly that one of the singularities of a special five-material wedge is independent of the crack direction.
引用
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页码:151 / 160
页数:10
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