Nanoscale accurate heterogeneous integration of waveguide devices by transfer printing

被引：0
|
作者：
Guilhabert, B. [1 ]
McPhillimy, J. [1 ]
Klitis, C. [2 ]
Dawson, M. D. [1 ]
Sorel, M. [2 ]
Strain, M. J. [1 ]
机构：
[1] Univ Strathclyde, Dept Phys, Inst Photon, Glasgow, Lanark, Scotland
[2] Univ Glasgow, Sch Engn, Glasgow, Lanark, Scotland
来源：
2018 IEEE PHOTONICS CONFERENCE (IPC) | 2018年
关键词：
Silicon-on-Insulator; Hybrid Integrated Circuits; Nano-positioning;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The vertical micro-assembly of membrane photonic devices across a range of materials is presented, including polymers, silicon and III-IV semiconductors. Fully-fabricated waveguide structures are integrated with sub-100nm absolute placement accuracy. Light-emitting diodes, silicon photonics and nanowire lasers are examples of the deployment of this technique.
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页数：2
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