System Integration for Miniature Node of Wireless Sensor Network (WSN)

被引：0

作者：

Xu, Gaowei ^{[1
]}

Song, Enliang ^{[1
]}

Chen, Xiao ^{[1
]}

Wang, Shuangfu ^{[1
]}

Zhu, Chunsheng ^{[1
]}

Ye, Jiaotuo ^{[1
]}

Luo, Le ^{[1
]}

机构：

[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China

来源：

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年

关键词：

SiP (system in package); three-dimensional (3D) package; embedded substrate; stack-up; combination of multiple interconnections; Miniature node of WSN;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A type of 3D-SiP (System in Package) package for wireless sensor network (WSN) node was designed and developed based on an embedded FR-4 substrate using 3D technology (including, embedded way and stacked way) and SiP technology. The 3D-SiP package including sensor (sound or vibration) module, baseband ASIC chips, digital signal processor (DSP) chips, other chips and various passive components, was studied. FCOB (flip-chip on board), COB (chip on board), BGA technologies, wire bonding flip-chip bonding and surface mount (SMT) etc. interconnection technologies were combined together. Several kinds of solder materials with different melting points were used for initial and final vertical interconnections for the sake of compatibility of all levels interconnections by reflowing. High density WSN node with ASIC chip embedded in and sensor module stacked on high density multi-layer FR-4 substrate was designed and manufactured. The thermal management was conducted and the thermal related reliability of 3D-SiP were simulated and evaluated respectively.

引用

页码：94 / 96

页数：3

共 50 条

[41] Wireless Sensor Network (WSN) Configuration Method to Increase Node Energy Efficiency through Clustering and Location Information
Kim, Jinsoo
Lee, Donghwan
Hwang, Jaejoon
Hong, Sunghoon
Shin, Dongil
Shin, Dongkyoo
SYMMETRY-BASEL, 2021, 13 (03): : 1 - 11
[42] Integration of Wireless Sensor Network and IoT for Smart Environment Monitoring System
Yu, Qi
Xiong, Feng
Wang, Yiran
JOURNAL OF INTERCONNECTION NETWORKS, 2022, 22 (SUPP02)
[43] Integration of Inertial Navigation System and Wireless Sensor Network for Mine Environment
Zhu Zhibin
Li Xunbo
Li Xiaobing
Qin Guangxu
PROCEEDINGS OF THE SECOND INTERNATIONAL SYMPOSIUM ON TEST AUTOMATION AND INSTRUMENTATION, VOL 4, 2008, : 1857 - 1860
[44] AI-WSN: Adaptive and Intelligent Wireless Sensor Network
Serpen, Gursel
Li, Jiakai
Liu, Linqian
COMPLEX ADAPTIVE SYSTEMS: EMERGING TECHNOLOGIES FOR EVOLVING SYSTEMS: SOCIO-TECHNICAL, CYBER AND BIG DATA, 2013, 20 : 406 - 413
[45] Priority Management with Clustering Approach in Wireless Sensor Network (WSN)
Rubel, Md. Saiful Islam
Kandil, Nahi
Hakem, Nadir
2018 SIXTH INTERNATIONAL CONFERENCE ON DIGITAL INFORMATION, NETWORKING, AND WIRELESS COMMUNICATIONS (DINWC), 2018, : 7 - 11
[46] A Hierarchical Routing Protocol for Survivability in Wireless Sensor Network (WSN)
Al-Fares, Mohammad S.
Sun, Zhili
Cruickshank, Haitharn
IMECS 2009: INTERNATIONAL MULTI-CONFERENCE OF ENGINEERS AND COMPUTER SCIENTISTS, VOLS I AND II, 2009, : 262 - 268
[47] Wireless Sensor Network Softwarization: Towards WSN Adaptive QoS
Ezdiani, Syarifah
Acharyya, Indrajit S.
Sivakumar, Sivaramakrishnan
Al-Anbuky, Adnan
IEEE INTERNET OF THINGS JOURNAL, 2017, 4 (05): : 1517 - 1527
[48] Measurement of agricultural parameters using wireless sensor network (WSN)
Guana-Moya, Javier
Sanchez-Almeida, Tarquino
Salgado-Reyes, Nelson
INTERNATIONAL CONFERENCE ON ELECTRICAL, ELECTRONICS, MATERIALS AND APPLIED SCIENCE, 2018, 1952
[49] Design on ZigBee Wireless Sensor Network Node
Deng, Hubin
Zhang, Lei
ADVANCED MATERIALS AND COMPUTER SCIENCE, PTS 1-3, 2011, 474-476 : 283 - 286
[50] Algorithm SESP of Wireless Sensor Network Node
Huang, Xuhong
INTELLIGENT DATA ANALYSIS AND APPLICATIONS, 2015, 370 : 489 - 496

← 1 2 3 4 5 →