Xerox creates self-assembling 3D structures on chips

被引：0
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作者：
Collins, L
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IEE REVIEW | 2002年 / 48卷 / 06期
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TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
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页码：8 / 8
页数：1
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