Mechanical strength analysis of SMT solder joints by the finite element method

被引：0
|
作者：
Wang, CQ
Wang, RJ
San, Y
Qian, YY
机构：
来源：
WELDING JOURNAL | 1997年 / 76卷 / 02期
关键词：
SMT; solder joint; finite element analysis; electronics; PCB; joint strength;
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Finite element calculation is applied to the analysis of stress inside surface mount technology (SMT) solder joints. The effects of shape, interior voids and volume of solder on the mechanical strength of SMT solder joints are analyzed and compared. This analysis is essential to the design and technology of SMT solder joints.
引用
收藏
页码：S67 / S69
页数：3
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