Various SEU conditions in SRAM studied by 3-D device simulation

被引:37
|
作者
Castellani-Coulié, K
Palau, JM
Hubert, G
Calvet, MC
Dodd, PE
Sexton, F
机构
[1] Univ Montpellier 2, F-34095 Montpellier 05, France
[2] Sandia Natl Labs, Albuquerque, NM 87185 USA
[3] EADS, LV, F-78133 Les Mureaux, France
关键词
critical charge; device simulation; sensitive regions; single-event upset (SEU); SEU mechanisms; SRAM sensitivity;
D O I
10.1109/23.983153
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Various single-event upset (SEU) conditions are studied by three-dimensional device simulation with the purpose of going deeply into the understanding of the mechanisms governing the SEU sensitivity for a large variety of tracks. The results give a better view of what regions are sensitive. They clearly point out that some generally accepted notions must be revised as considering the normal incidence case to be the most sensitive or neglecting PMOS contribution.
引用
收藏
页码:1931 / 1936
页数:6
相关论文
共 50 条
  • [41] Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM
    Lee, Kang-Wook
    Bea, Ji-Chel
    Murugesan, Mariappan
    Fukushima, Takafumi
    Tanaka, Tetsu
    Koyanagi, Mitsumasa
    2015 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2015,
  • [42] 3-D Cameras A Novel Method and Device for 3-D Imaging Using Light Detection and Ranging
    Lim, Jaechan
    Kim, Taemin
    IEEE INDUSTRIAL ELECTRONICS MAGAZINE, 2015, 9 (03) : 6 - 8
  • [43] Nanoelectronic 3-D (NEMO 3-D) simulation of multimillion atom quantum dot systems
    Oyafuso, F
    Klimeck, G
    Bowen, RC
    Boykin, TB
    SISPAD 2002: INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, 2002, : 163 - 166
  • [44] Research on 3-D device of infrared temperature detection
    Chen, Shuxin
    Jiang, Shaohua
    Hou, Jie
    Chen, Shuwang
    3RD INTERNATIONAL SYMPOSIUM ON ADVANCED OPTICAL MANUFACTURING AND TESTING TECHNOLOGIES: OPTICAL TEST AND MEASUREMENT TECHNOLOGY AND EQUIPMENT, PARTS 1-3, 2007, 6723
  • [45] INPUT DEVICE GUIDELINES FOR 3-D DISPLAY SYSTEMS
    BEATON, RJ
    COMPUTER DESIGN, 1988, 27 (05): : 48 - 48
  • [46] A new optical 3-D device for the detection of wear
    Mehl, A
    Gloger, W
    Kunzelmann, KH
    Hickel, R
    JOURNAL OF DENTAL RESEARCH, 1997, 76 (11) : 1799 - 1807
  • [47] 3-D medical device saves design time
    不详
    MECHANICAL ENGINEERING, 2000, 122 (05) : 18 - 18
  • [48] Automated 3-D crack growth simulation
    Carter, BJ
    Wawrzynek, PA
    Ingraffea, AR
    INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, 2000, 47 (1-3) : 229 - 253
  • [49] 3-D Parallel Fault Simulation With GPGPU
    Li, Min
    Hsiao, Michael S.
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2011, 30 (10) : 1545 - 1555
  • [50] 3-D simulation of RIM mold filling
    Gaofenzi Cailiao Kexue Yu Gongcheng, 5 (5-7):