Fabrication of Bi2Te3 nanowire arrays and thermal conductivity measurement by 3ω-scanning thermal microscopy

被引:51
|
作者
Munoz Rojo, M. [1 ]
Grauby, S. [2 ]
Rampnoux, J. -M. [2 ]
Caballero-Calero, O. [1 ]
Martin-Gonzalez, M. [1 ]
Dilhaire, S. [2 ]
机构
[1] CSIC, IMM, Madrid 28760, Spain
[2] Univ Bordeaux, LOMA, UMR 5798, F-33405 Talence, France
基金
欧洲研究理事会;
关键词
BISMUTH TELLURIDE FILMS; SILICON NANOWIRES; ELECTRODEPOSITION; NANOTUBES; PROBES;
D O I
10.1063/1.4790363
中图分类号
O59 [应用物理学];
学科分类号
摘要
Bi2Te3 is well-known for its utility in thermoelectrical applications and more recently as topological insulator. Its nanostructuration has attracted plenty of attention because of its potential capacity to reduce thermal conductivity. Here, we have grown a composite sample made of a Bi2Te3 nanowires (NWs) array embedded in an alumina matrix. We have then performed scanning thermal microscopy (SThM) in a 3 omega configuration to measure its equivalent thermal resistance. Using an effective medium model, we could then estimate the mean composite thermal conductivity as well as the thermal conductivity of the NWs to be, respectively, (lambda(C)) (1.68 +/- 0.20) W/mK and (lambda(NW)) - (1.37 +/- 0.20) W/mK, showing a slight thermal conductivity reduction. Up to now, there have been two main techniques reported in literature to evaluate the thermal conductivity of nanostructures: the use of a thermal microchip to probe a single NW once its matrix has been dissolved or the probing of the whole NWs array embedded in a matrix, obtaining the thermal conductivity of the whole as an effective medium. However, the 3 omega-SThM presented here is the only technique able to measure the thermal conductivity of single NWs embedded in a matrix as well as the thermal conductivity of the composite locally. This technique is more versatile and straightforward than other methods to obtain the thermal conductivity of nanostructures. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4790363]
引用
收藏
页数:7
相关论文
共 50 条
  • [2] Measurement of thermal conductivity of Bi2Te3 nanowire using high-vacuum scanning thermal wave microscopy
    Park, Kyungbae
    Hwang, Gwangseok
    Kim, Hayeong
    Kim, Jungwon
    Kim, Woochul
    Kim, Sungjin
    Kwon, Ohmyoung
    APPLIED PHYSICS LETTERS, 2016, 108 (07)
  • [3] Measurements of Bi2Te3 nanowire thermal conductivity and Seebeck coefficient
    Li, DY
    Prieto, AL
    Wu, YY
    Martin-Gonzalez, MS
    Stacy, A
    Sands, T
    Gronsky, R
    Yang, P
    Majumdar, A
    XXI INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '02, 2002, : 333 - 336
  • [4] Thermal Conductivity of Bi2Te3 Nanowires and Nanotubes
    Li, Shen
    Stein, Nicolas
    Lacroix, David
    Termentzidis, Konstantinos
    2015 21ST INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2015,
  • [5] Pulsed electrodeposition of Bi2Te3 and Bi2Te3/Te nanowire arrays from a DMSO solution
    Li, Wen-Jin
    Yu, Way-Ling
    Yen, Chia-Ying
    ELECTROCHIMICA ACTA, 2011, 58 : 510 - 515
  • [6] Electrodeposition of ordered Bi2Te3 nanowire arrays
    Prieto, AL
    Sander, MS
    Martín-González, M
    Gronsky, R
    Sands, T
    Stacy, AM
    JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2001, 123 (29) : 7160 - 7161
  • [7] Synthesis and Characterization of Bi2Te3/Te Superlattice Nanowire Arrays
    Ma, Lisha
    Zhang, Qiang
    Zhao, Qinqin
    Li, Zhipeng
    Ji, Changjian
    Xu, X. J.
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 16 (01) : 1207 - 1210
  • [8] Electrochemical fabrication of large-area, ordered Bi2Te3 nanowire arrays
    Jin, CG
    Xiang, XQ
    Jia, C
    Liu, WF
    Cai, WL
    Yao, LZ
    Li, XG
    JOURNAL OF PHYSICAL CHEMISTRY B, 2004, 108 (06): : 1844 - 1847
  • [9] LATTIC THERMAL CONDUCTIVITY OF BI2TE3 BASE SOLID SOLUTIONS
    GURIEVA, EA
    KUTASOV, VA
    SMIRNOV, IA
    SOVIET PHYSICS SOLID STATE,USSR, 1965, 6 (08): : 1945 - &
  • [10] MOLECULAR DYNAMICS SIMULATIONS OF THERMAL CONDUCTIVITY OF BI2TE3 NANOWIRES
    Qiu, Bo
    Sun, Lin
    Ruan, Xiulin
    IMECE 2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 12, PTS A AND B, 2010, : 1003 - 1010