Pressureless Silver Sintering Die-Attach for SiC Power Devices

被引：13

作者：

Hascoet, Stanislas ^{[1
]}

Buttay, Cyril ^{[1
]}

Planson, Dominique ^{[1
]}

Chiriac, Rodica ^{[2
]}

Masson, Amandine ^{[1
]}

机构：

[1] Univ Lyon, INSA Lyon, Lab Ampere, CNRS,UMR 5005, F-69621 Villeurbanne, France

[2] Univ Lyon, CNRS UMR 5615, LMI, F-69622 Lyon, France

来源：

SILICON CARBIDE AND RELATED MATERIALS 2012 | 2013年 / 740-742卷

关键词：

silver sintering; die-attach;

D O I：

10.4028/www.scientific.net/MSF.740-742.851

中图分类号：

O7 [晶体学];

学科分类号：

0702 ; 070205 ; 0703 ; 080501 ;

摘要：

Pressureless silver sintering is an interesting die-attach technique that could overcome the reliability limitations of the power electronic devices caused by their packaging. In this paper, we study the manufacturing parameters that affect the die attach: atmosphere, drying time, heating ramp rate, sintering temperature and duration. It is found that sintering under air gives better results, but causes the substrates to oxidize. Sintering under nitrogen keeps the surfaces oxide-free, at the cost of a weaker attach.

引用

页码：851 / +

页数：2

共 50 条

[21] Pressure-less Plasma Sintering of Cu Paste for SiC Die-Attach of High-Temperature Power Device Manufacturing
Nagao, S.
Kodani, K.
Sakamoto, S.
Park, S. -W.
Sugahara, T.
Suganuma, K.
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1077 - 1079
[22] Thermostable porous Ag die-attach structure for high-temperature power devices
Noh, Seungjun
Zhang, Hao
Suganuma, Katsuaki
2018 SECOND INTERNATIONAL SYMPOSIUM ON 3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING (3D-PEIM), 2018,
[23] Impact Test Performance of Zn-based Die-attach Joints for Power Devices
Song, Jenn-Ming
Lin, Meng-Ju
Lai, Yi-Shao
Chiu, Ying-Ta
2012 2ND IEEE CPMT SYMPOSIUM JAPAN, 2012,
[24] Low-temperature MOD assisted sintering of Ag nanoparticles for power device die-attach
Liu, Xun
Li, Junjie
Liu, Li
Zhu, Pengli
Zhao, Tao
Sun, Rong
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 532 - 537
[25] Silver Sintering Die Attach Process for IGBT Power Module Production
Zhao, Yimin
Mumby-Croft, Paul
Jones, Steve
Dai, Andy
Dou, Zechun
Wang, Yafei
Qin, Feng
2017 THIRTY SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2017, : 3091 - 3094
[26] Sintering of Ag paste for power devices die attach on Cu surfaces
Manikam, Vemal Raja
Tolentino, Erik Nino
2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 94 - 98
[27] First failure point of a SiC power module with sintered Ag die-attach on reliability tests
Sugiura, Kazuhiko
Iwashige, Tomohito
Tsuruta, Kazuhiro
Chen, Chuantong
Nagao, Shijo
Zhang, Hao
Sugahara, Tohru
Suganuma, Katsuaki
2017 International Conference on Electronics Packaging, ICEP 2017, 2017, : 97 - 100
[28] ADVANCES IN EPOXY DIE-ATTACH
DAVID, RFS
SOLID STATE TECHNOLOGY, 1975, 18 (09) : 40 - 44
[29] First Failure Point of a SiC Power Module with Sintered Ag Die-Attach on Reliability Tests
Sugiura, Kazuhiko
Iwashige, Tomohito
Tsuruta, Kazuhiro
Chen, Chuantong
Nagao, Shijo
Zhang, Hao
Sugahara, Tohru
Suganuma, Katsuaki
2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 97 - 100
[30] High Thermal Die-Attach Paste Development for Analog Devices
Higaki, Kiichiro
Takahashi, Toru
Ono, Akinori
Koike, Daisuke
Hori, Masahiko
Kusaka, Keiichi
Nishi, Takayuki
Mori, Takeshi
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1414 - 1421

← 1 2 3 4 5 →