The estimation of thermal resistance at various interfaces

被引:0
|
作者
Argyropoulos, SA [1 ]
Goudie, NJ [1 ]
Trovant, M [1 ]
机构
[1] Univ Toronto, Dept Met & Mat Sci, Toronto, ON M5S 3E4, Canada
关键词
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Two studies were carried out to estimate the thermal resistance of various interfaces using experimental and computational techniques. Three types of interfaces were examined. The first study investigated metal-mold interfaces, and the second study focused on metal-metal and metal-oxide interfaces. For the metal-mold interface, the air gap size was measured and subsequently correlated with the interface thermal resistance. The procedural details are outlined for the development of a correlation which predicts thermal resistance as a function of air gap size. Investigation of the metal-metal and metal-oxide interfaces employed data from a series of experiments as input into a model, which solved the inverse heat conduction problem in terms of a resistance estimate. These experiments, involved dipping a cold cylindrical metal into a liquid metal or liquid oxide, respectively. Under these conditions, a shell freezes around the cylindrical addition and a thermal resistance develops during the time period which shell exists. The Heat Transfer Coefficient (HTC) at the addition shell interface differs significantly among the various types of metals and oxides used. In the case of an oxide shell, the (HTC) is about an order of magnitude lower than the (HTC) of the metal shell.
引用
收藏
页码:535 / 542
页数:8
相关论文
共 50 条
  • [1] THERMAL-RESISTANCE AT INTERFACES
    SWARTZ, ET
    POHL, RO
    APPLIED PHYSICS LETTERS, 1987, 51 (26) : 2200 - 2202
  • [2] Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
    H.Y. Guo
    J.D. Guo
    J.K. Shang
    Journal of Electronic Materials, 2009, 38 : 2470 - 2478
  • [3] Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
    Guo, H. Y.
    Guo, J. D.
    Shang, J. K.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) : 2470 - 2478
  • [4] TECHNIQUE FOR THE ESTIMATION OF THERMAL-RESISTANCE AT SOLID METAL INTERFACES FORMED DURING SOLIDIFICATION AND MELTING
    GOUDIE, NJ
    ARGYROPOULOS, SA
    CANADIAN METALLURGICAL QUARTERLY, 1995, 34 (01) : 73 - 84
  • [5] Evaluation of thermal resistance of various thermal grease
    Seki, S.
    Endoh, R.
    Takeda, M.
    2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2018, : 576 - 578
  • [6] Thermal Resistance of GaN/AlN Graded Interfaces
    van Roekeghem, Ambroise
    Vermeersch, Bjorn
    Carrete, Jesus
    Mingo, Natalio
    PHYSICAL REVIEW APPLIED, 2019, 11 (03)
  • [7] Thermal contact resistance at elastomer to metal interfaces
    Parihar, SK
    Wright, NT
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 1997, 24 (08) : 1083 - 1092
  • [8] Thermal resistance of nanowire-plane interfaces
    Bahadur, V
    Xu, J
    Liu, Y
    Fisher, TS
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2005, 127 (06): : 664 - 668
  • [9] Thermal metrology for deeply buried low-thermal-resistance interfaces
    Gaitonde, Aalok U.
    Weibel, Justin A.
    Marconnet, Amy M.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2025, 241
  • [10] Thermal contact conductance of various metal interfaces at cryogenic temperature
    Kim, Myung Su
    Seo, Young Ho
    Choi, Yeon Suk
    INTERNATIONAL JOURNAL OF NANOTECHNOLOGY, 2019, 16 (4-5) : 213 - 219