Packaging of the RF-MEMS switch

被引：1
|
作者：
Park, HW
Park, YK
Lee, DJ
Ju, BK
机构：
来源：
DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS II | 2001年 / 4593卷
关键词：
D O I：
10.1117/12.448864
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250 mum diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within - 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.
引用
收藏
页码：234 / 243
页数：10
相关论文
共 50 条
  • [41] Lifetime measurements on a high-reliability RF-MEMS contact switch
    Newman, Harvey S.
    Ebel, John L.
    Judy, Daniel
    Maciel, John
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2008, 18 (02) : 100 - 102
  • [42] Development of piezoelectric RF-MEMS switch driven by low operating voltage
    Kanno, Isaku
    Suzuki, Takaaki
    Endo, Hironobu
    Kotera, Hidetoshi
    Advances in Electronic Packaging 2005, Pts A-C, 2005, : 2033 - 2036
  • [43] BEOL Embedded RF-MEMS Switch for mm-Wave Applications
    Kaynak, M.
    Ehwald, K. E.
    Drews, J.
    Scholz, R.
    Korndoerfer, F.
    Knoll, D.
    Tillack, B.
    Barth, R.
    Birkholz, M.
    Schulz, K.
    Sun, Y. M.
    Wolansky, D.
    Leidich, S.
    Kurth, S.
    Gurbuz, Y.
    2009 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, 2009, : 745 - +
  • [44] The package integration of RF-MEMS switch and control IC for wireless applications
    De Silva, AP
    Hughes, HG
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (03): : 255 - 260
  • [45] RF-MEMS switch design optimization for long-term reliability
    Viviana Mulloni
    Francesco Solazzi
    Giuseppe Resta
    Flavio Giacomozzi
    Benno Margesin
    Analog Integrated Circuits and Signal Processing, 2014, 78 : 323 - 332
  • [46] RF-MEMS switch using carbon nanotube composite gold electroplating
    Izuo S.-I.
    Yoshida Y.
    Soda S.-N.
    Ogawa S.
    Lee S.S.
    Sakai Y.
    Fukumoto H.
    IEEJ Transactions on Sensors and Micromachines, 2010, 130 (05) : 165 - 169+3
  • [47] RF-MEMS switch design optimization for long-term reliability
    Mulloni, Viviana
    Solazzi, Francesco
    Resta, Giuseppe
    Giacomozzi, Flavio
    Margesin, Benno
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2014, 78 (02) : 323 - 332
  • [48] Development of RF-MEMS ohmic contact switch for mobile handsets applications
    Fujiwara, Takeshi
    Seki, Tomonori
    Sato, Fumihiko
    Oba, Masatoshi
    2012 42ND EUROPEAN MICROWAVE CONFERENCE (EUMC), 2012, : 180 - 183
  • [49] RF-MEMS Switch and Phase Shifter Optimized for W-Band
    Stehle, A.
    Georgiev, G.
    Ziegler, V.
    Schoenlinner, B.
    Prechtel, U.
    Seidel, H.
    Schmid, U.
    2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2008, : 870 - +
  • [50] Optimized vertical RF-MEMS switch design with a small actuation voltage
    Dalal, Kusum
    Singh, Tejbir
    Singh, Pawan Kumar
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2021, 108 (01) : 165 - 171
12345