Packaging of the RF-MEMS switch

被引：1
|
作者：
Park, HW
Park, YK
Lee, DJ
Ju, BK
机构：
来源：
DESIGN, CHARACTERIZATION, AND PACKAGING FOR MEMS AND MICROELECTRONICS II | 2001年 / 4593卷
关键词：
D O I：
10.1117/12.448864
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250 mum diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within - 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.
引用
下载
收藏
页码：234 / 243
页数：10
相关论文
共 50 条
  • [1] Characterization of an Embedded RF-MEMS Switch
    Kaynak, M.
    Ehwald, K. E.
    Scholz, R.
    Korndoerfer, F.
    Wipf, C.
    Sun, Y. M.
    Tillack, B.
    Zihir, S.
    Gurbuz, Y.
    2010 TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, 2010, : 144 - +
  • [2] RF-MEMS: Materials and technology, integration and packaging
    Tilmans, HAC
    MATERIALS, INTEGRATION AND PACKAGING ISSUES FOR HIGH-FREQUENCY DEVICES, 2004, 783 : 79 - 90
  • [3] Impact of thermal cycles during the packaging assembly process on RF-MEMS switch performance
    De Silva, AP
    Liu, L
    Hughes, HG
    2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2003, 5288 : 407 - 411
  • [4] An above-IC RF-MEMS switch
    Saias, D
    Boret, S
    Robert, P
    Billard, C
    Charvet, PL
    Bouche, G
    Diem, B
    Quoirin, JB
    Berruyer, P
    Laurens, M
    Grasset, JC
    Aid, M
    Belot, D
    Ancey, P
    2003 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE: DIGEST OF TECHNICAL PAPERS, 2003, 46 : 206 - 207
  • [5] An RF-MEMS Switch with mN Contact Forces
    Patel, Chirag D.
    Rebeiz, Gabriel M.
    2010 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (MTT), 2010, : 1242 - 1245
  • [6] Reliability Research of Capacitive RF-MEMS Switch
    Song, Mingxin
    Wu, Rui
    Liu, Qian
    Wang, Hong
    Gao, Zuobao
    Chen, Minghua
    Yin, Jinghua
    MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4, 2013, 753-755 : 2507 - 2510
  • [7] RF-MEMS Switch Analysis with Lattice Structure
    Song, Mingxin
    Wu, Rui
    2014 8TH INTERNATIONAL CONFERENCE ON FUTURE GENERATION COMMUNICATION AND NETWORKING (FGCN), 2014, : 56 - 59
  • [8] Switch-line phase shifter with RF-MEMS switch
    Chen, Hua-Jun
    Guo, Dong-Hui
    Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University, 2007, 41 (SUPPL.): : 32 - 35
  • [9] A novel and efficient packaging technology for RF-MEMS devices
    Theunis, F.
    Lisec, T.
    Reinert, W.
    Bielen, J.
    Yang, D.
    de Jongh, M.
    Krusemann, P. V. E.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1239 - +
  • [10] Polarization Reconfigurable Antenna on RF-MEMS Packaging Platform
    Jung, Tony J.
    Hyun, Ik-Jae
    Kim, Jong-Man
    Baek, Chang-Wook
    Lim, Sungjoon
    APMC: 2009 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5, 2009, : 579 - +
12345