Reduction of Defect X in Module Line at Company Y Using Lean Six Sigma

Lean Six Sigma is an effective technique that deals in eliminating defects in the processes using its known methodology which is the DMAIC. The researchers applied this in module line at Company Y. The company together with the researchers created a team to conduct this study. The researchers used Pareto chart and they identified that Direct Copper Bond (DCB). Dent defect is the primary defect occurring in the module line. The researchers focused their study on this. The researchers presented the data of defect from December 2017 to May 2018. They chose the month April 2018 where DCB Dent occurred the most. Ishikawa Diagram and Why-Why analysis were used to find the root cause of Defect X. The researchers were able to identify that the main problem is from the material: dirty plane plates and housing. Corrective action and preventive action were developed by the team. Due to time constraint, the improvement was only done within two weeks of July. The improvement done by the team was successful, supported by the sigma level which was increased into 3.98 from 3.64 after implementing the corrective action. To sustain the improvement, the corrective action must be clone in straightening section.