Residual stresses in porcelain tiles. Measurement and process variables assessment

被引:8
|
作者
Sanchez, E. [1 ]
Sanz, V [1 ]
Castellano, J. [1 ]
Sales, J. [2 ]
Kayaci, K. [3 ]
Taskiran, M. U. [3 ]
Anil, U. E. [3 ]
Turk, S. [3 ]
机构
[1] Univ Jaume 1, ITC, Castellon de La Plana 12071, Spain
[2] GEA CERAM SL, Castellon de La Plana, Spain
[3] Kaleseram Canakkale Kalebodur, Can, Turkey
关键词
Residual stresses; Strain relaxation method; Porcelain tiles; Process variables; Polishing; THERMAL-CONDUCTIVITY; BEHAVIOR; PHASE;
D O I
10.1016/j.jeurceramsoc.2019.04.038
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This research addresses the residual stresses phenomenon taking place during the manufacture of porcelain tiles. Residual stresses were quantified by the strain relaxation slotting method. The method is based on the fact that stresses are released when a slot is made leading to a curvature change. Once the method was validated, the impact of process variables such as starting body composition, temperature and cooling rate of firing cycle was investigated. Findings showed that cooling rate was the most influencing variable whereas Young's modulus of fired specimens also play a significant role. Symmetry of the parabolic residual stress profile denoted homogenous cooling on upper and lower tile surfaces during the cooling step. In addition, it was observed that polishing of a stressed tile gives rise to a decreasing of deformation as a consequence of stress release by mechanical grinding.
引用
收藏
页码:3364 / 3372
页数:9
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