Delaunay-Voronoi modeling of power-ground planes with source port correction

被引:33
|
作者
Wu, Kai-Bin [1 ,2 ]
Shiue, Guang-Hwa [3 ]
Guo, Wei-Da [1 ,2 ]
Lin, Chien-Min [4 ]
Wu, Ruey-Beei [1 ,2 ]
机构
[1] Natl Taiwan Univ, Dept Elect Engn, Taipei 10617, Taiwan
[2] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei 10617, Taiwan
[3] Chung Yuan Christian Univ Sci & Technol, Chungli 32023, Taiwan
[4] Taiwan Semicond Mfg Co Ltd, Backend Technol Dev Div, Hsinchu 30077, Taiwan
来源
关键词
Delaunay triangular mesh; plane impedance; power distribution network; SPICE-compatible model; via effect; virtual port; Voronoi tessellation;
D O I
10.1109/TADVP.2008.920326
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An efficient Delaunay-Voronoi modeling of the power-ground planes suitable directly for SPICE compatibity is proposed to deal with the ground bounce noise and decoupling capacitors placement problems for the high-speed digital system designs. The model consists of virtual ports and triangular meshes with the lumped circuit elements, in which all the element values can be related to the mesh geometry shape by the analogy between the circuit equations and Maxwell's equations. Since the analogy fails to apply due to the singular fields near the input/output pins, the via effect of driving and sensing ports is not negligible and an analytical expression from the Hankel function is thus presented for the correction term. A simple rule has been investigated for the model with minimum lumped circuit elements to accurately represent the power-ground planes over the frequency range of interests. The full-wave simulation and measurement results verify the good correlations with the proposed models for the impedance responses of regular and defective plane shapes.
引用
收藏
页码:303 / 310
页数:8
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共 45 条
  • [1] Hybrid Modeling Method for Multilayered Power/Ground Planes by Delaunay Triangulation
    Watanabe, Takayuki
    [J]. 2014 IEEE 23RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2014, : 155 - 158
  • [2] Efficient modeling of rerouted return currents in multilayered power-ground planes by using integral equation
    Wei, Xing-Chang
    Li, Er-Ping
    Liu, En-Xiao
    Xing Cui
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2008, 50 (03) : 740 - 743
  • [3] EMI and EMC Analysis of Arbitrarily Shaped Power-Ground Planes
    Zou, Guo-Ping
    Li, Er-Ping
    Wei, Xing-Chang
    Luo, Guang-Xiao
    Xiang-Cui
    [J]. 2010 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & TECHNICAL EXHIBITION ON EMC RF/MICROWAVE MEASUREMENTS & INSTRUMENTATION, 2010, : 660 - 663
  • [4] Modeling of Arbitrary Power-Ground Planes with Slot by Using Integral Equation and Transmission Line Method
    Zou, Guo-Ping
    Li, Er-Ping
    Wei, Xing-Chang
    Cui, Xiang
    Luo, Guang-xiao
    [J]. APMC: 2009 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5, 2009, : 2428 - +
  • [5] A Discontinuous Galerkin Time-Domain Method for Modeling of Power-Ground Planes with Narrow Slots and Signal Vias
    Lee, Hui Min
    Gao, Si-Ping
    Liu, En-Xiao
    [J]. 2017 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2017, : 288 - 290
  • [6] High frequency input impedance characterization of dielectric films for power-ground planes
    Obrzut, J
    [J]. IMTC 2002: PROCEEDINGS OF THE 19TH IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE, VOLS 1 & 2, 2002, : 1341 - 1343
  • [7] Are on-chip power-ground planes really needed? A signal integrity perspective
    Elfadel, IM
    Feldmann, P
    Chen, H
    Ostapko, D
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2004, : 307 - 310
  • [8] Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method
    Wei, Xing-Chang
    Li, Er-Ping
    Liu, En-Xiao
    Chua, Eng-Kee
    Oo, Zaw-Zaw
    Vahldieck, R.
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (03): : 536 - 543
  • [9] Two-Dimensional Discontinuous Galerkin Time-Domain Method for Modeling of Arbitrarily Shaped Power-Ground Planes
    Lee, Hui Min
    Gao, Siping
    Liu, En-Xiao
    Samudra, G. S.
    Li, Er-Ping
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2015, 57 (06) : 1744 - 1747
  • [10] Analytical Extraction of Via-Via Inductance by Using SMM for Power-Ground Planes
    Luo, Guang-Xiao
    Wei, Xing-Chang
    Cui, Xiang
    Li, Er-Ping
    [J]. 2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,