The modified crystallography of tin in Al-Cu-Sn

被引:0
|
作者
Bourgeois, Laure [1 ]
Nie, Jian-Feng [1 ]
Muddle, Barry C. [1 ]
机构
[1] Monash Univ, Dept Mat Engn, Clayton, Vic 3800, Australia
关键词
aluminium alloy; tin; Crystallography; nucleation; HRTEM; atom probe;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The crystallographic identity of tin particles formed during the early stages of solid solution decomposition in an Al-1.7at.%Cu-0.01at.%Sn alloy has been investigated by high resolution transmission electron microscopy. It was found that in association with Cu-rich precipitates (GP zones or theta') having just nucleated, tin favours an orientation relationship relative to the aluminium matrix that is distinctly different from that observed in the binary alloy Al-0.01at.%Sn. This observation implies that the presence of copper modifies the preferred crystallographic identity of tin particles in Al-Cu-Sn. Three-dimensional atom probe microscopy confirms that tin and copper solute clusters interact before precipitation of the crystalline phases.
引用
收藏
页码:517 / 522
页数:6
相关论文
共 50 条
  • [31] Heterogeneous Nucleation of Bulk Cu6Sn5 in Sn-Ag-Cu-Al and Sn-Cu-Al Solders
    Xian, J. W.
    Belyakov, S. A.
    Britton, T. B.
    Gourlay, C. M.
    2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 2241 - 2247
  • [32] Precipitation processes in Al-Cu-Mg-Sn and Al-Cu-Mg-Sn-Ag
    Poon, I.
    Marceau, R. K. W.
    Xia, J.
    Liao, X. Z.
    Ringer, S. P.
    MATERIALS & DESIGN, 2016, 96 : 385 - 391
  • [33] Production of ultrafine microstructure in Al-Sn, Al-Sn-Cu and Al-Sn-Cu-Si alloys for use in tribological applications
    Harris, S.J.
    McCartney, D.G.
    Horlock, A.J.
    Perrin, C.
    Materials Science Forum, 2000, 331
  • [34] Production of ultrafine microstructures in Al-Sn, Al-Sn-Cu and Al-Sn-Cu-Si alloys for use in tribological applications
    Harris, SJ
    McCartney, DG
    Horlock, AJ
    Perrin, C
    ALUMINIUM ALLOYS: THEIR PHYSICAL AND MECHANICAL PROPERTIES, PTS 1-3, 2000, 331-3 : 519 - 525
  • [35] Transformation of Sn-Cu alloy from white tin to gray tin
    Joo, YJ
    Takemoto, T
    MATERIALS LETTERS, 2002, 56 (05) : 793 - 796
  • [36] GENERAL TREATMENT OF DISTRIBUTION OF VACANCIES TO SOLUTE ATOMS IN A TERNARY SOLID-SOLUTION AND ITS APPLICATION TO LOW-TEMPERATURE AGING IN AL-CU-SN ALLOYS
    KIMURA, H
    HASIGUTI, RR
    TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1975, 16 (06): : 361 - 368
  • [37] Tin whisker growth on immiscible Al–Sn alloy
    Yan Zhang
    Peigen Zhang
    Wei He
    Zhengming Sun
    Journal of Materials Science: Materials in Electronics, 2020, 31 : 1328 - 1334
  • [38] Dynamic Viscosities of Pure Tin and Sn-Ag, Sn-Cu, and Sn-Ag-Cu Eutectic Melts
    Rozhitsina, E. V.
    Gruner, S.
    Kaban, I.
    Hoyer, W.
    Sidorov, V. E.
    Popel', P. S.
    RUSSIAN METALLURGY, 2011, (02): : 118 - 121
  • [39] Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn-Ag-Cu solder joints
    Chen, Wen-Lin
    Yu, Chi-Yang
    Ho, Cheng-Ying
    Duh, Jenq-Gong
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 613 : 193 - 200
  • [40] The surface phases of tin in (100)Fe-Sn and Cu-Sn alloys
    Vyatkin, GP
    Privalova, TP
    Chudakov, AE
    DOKLADY AKADEMII NAUK, 1998, 363 (02) : 198 - 200