Air Cavity Transmission Lines for Off-Chip Interconnects Characterized to 40 GHz

被引：5

作者：

Spencer, Todd J. ^{[1
]}

Saha, Rajarshi ^{[1
]}

Chen, Jikai ^{[2
]}

Bashirullah, Rizwan ^{[2
]}

Kohl, Paul A. ^{[3
]}

机构：

[1] Georgia Inst Technol, Dept Chem Engn, Atlanta, GA 30332 USA

[2] Univ Florida, Dept Elect Engn, Gainesville, FL 32601 USA

[3] Georgia Inst Technol, Dept Chem & Biomol Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2012年 / 2卷 / 03期

关键词：

Air gap; interconnect; microstrip; off-chip; COPPER; GAPS;

D O I：

10.1109/TCPMT.2011.2179045

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, air cavity transmission lines are integrated into printed circuit boards and packages to enable high-speed low-loss chip-to-chip communication. Microstripline and parallel plate structures with copper conductors separated by an air gap dielectric layer are described. The structures use a sacrificial placeholder material along with conventional microelectronics techniques to create a unique buried copper-air-copper microstripline structure. Transmission lines were characterized by S-parameter measurements to 40 GHz. The capacitance was tracked during fabrication to analyze the impact of the air gap. The effective dielectric constant of the final buried copper-air-copper structure was as low as 1.25.

引用

页码：367 / 374

页数：8

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