Mixed convection in an inclined channel with heated porous blocks

被引:17
|
作者
Guerroudj, N. [1 ]
Kahalerras, H. [1 ]
机构
[1] Houari Boumediene Univ Sci & Technol, Fac Mech & Proc Engn, Bab Ezzouar, Algeria
关键词
Heat transfer; Flow; Convection; Cooling systems; Mixed convection; Porous blocks; Inclined channel; FORCED-CONVECTION; ENTRANCE REGION; FLUID-FLOW; LAMINAR; DUCT; MEDIA; PLATE; LAYER;
D O I
10.1108/09615531211255743
中图分类号
O414.1 [热力学];
学科分类号
摘要
Purpose - The purpose of this paper is to study numerically the fluid flow and heat transfer in an inclined channel provided with heated porous blocks on its lower plate. Design/methodology/approach - The Brinkman-Forchheimer extended Darcy model with the Boussinesq approximation is adopted for the flow in the porous regions. The governing equations with the appropriate boundary conditions are solved by the control volume method. The effect of some pertinent parameters such as the buoyancy force intensity, the porous blocks shape and height, the porous medium permeability and the Reynolds number are analyzed for various inclination angles ranging from -90 degrees to +90 degrees. Findings - The results reveal, essentially, that the inclination angle of the channel can alter substantially the fluid flow and heat transfer mechanisms, especially at high Richardson and Darcy numbers. In this case, the maximum and minimum global Nusselt numbers are reached for alpha = +90 degrees and alpha = -90 degrees, respectively. Research limitations/implications - The results obtained in this work are valid for an inclined channel with porous blocks attached on the heated parts of the lower plate, whereas the upper wall is thermally insulated. Practical implications - The results obtained in this worky can be used in the thermal control of electronic components. The use of porous blocks mounted on the heat sources will increase the rate of heat removal in order to maintain the electronic components at an acceptable operating temperature. Originality/value - The paper provides an interesting method to improve the cooling of electronic devices by use of a porous medium.
引用
收藏
页码:839 / 861
页数:23
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