Multichip modules with laminated micro interconnect

被引：0

作者：

Chen, YK ^{[1
]}

Egbert, WC ^{[1
]}

Kane, D ^{[1
]}

Schultz, JC ^{[1
]}

机构：

[1] 3M Co, Fiber Opt & Elect Mat Technol Ctr, St Paul, MN 55144 USA

来源：

1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS | 1999年 / 3830卷

关键词：

flexible circuit substrate; flip chip; high density package; microvia; multi-chip module; reliability;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The limited routing capabilities of available substrates for space-limited complex circuits force a cost-performance trade-off for dense circuit designs incorporating high lead count devices. 3M Laminated Micro Interconnect (LMI) technology offers high performance, dense routing in a flexible polymer film package which is compatible with flip chip solder reflow or conductive adhesive die attach techniques. In this paper we discuss the basic LMI construction and contrast it to conventional built-up multilayer approaches. LMI Design Rules and routing capability are illustrated by a GPS receiver test vehicle. The environmental reliability of the LMI structure is characterized with data from Daisy Chain and Kelvin structures built into LMI test vehicles.

引用

页码：46 / 51

页数：6

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