Infrared measurements of temperature anomalies in electronic devices

被引:0
|
作者
Stoynova, Anna [1 ]
Bonev, Borislav [2 ]
Kafadarova, Nadezhda [3 ]
Rizanov, Stefan [2 ]
机构
[1] Tech Univ Sofia, Dept Microelect, Sofia, Bulgaria
[2] Tech Univ Sofia, Dept Elect, Sofia, Bulgaria
[3] Plovdiv Univ Paisii Hilendarski, Dept Elect Commun & Informat Technol, Plovdiv, Bulgaria
关键词
infrared measurements; passive thermography; temperature anomaly; electronic components; production of electronic devices;
D O I
10.1109/ESTC55720.2022.9939431
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The utilization of infrared techniques is accompanied by intrinsic difficulties, which often lead to a significant reduction in measurement accuracy. The electromagnetic signal, emitted by the investigated electronic device, is quite complex and the task of infrared temperature measurement requires non-trivial solutions. When electronic devices are under evaluation and their corresponding heat signature data is being analyzed - the analytical process is often directed towards "thermal abnormalities". Within this article, a developed thermographic measurement system is presented. Described are its functional capabilities and presented is experimental data - resulting from its utilization as part of a diagnostic setup for integrated circuits; electronic modules and components; PCBs. An emphasis is made towards specific thermal image processing techniques, aimed at increasing measurement accuracies. The necessary input data for an uncertainty evaluation is discussed. A series of experimental measurements of different electronic modules is presented, as a means for illustrating the capabilities of the developed instrumentation.
引用
收藏
页码:509 / 515
页数:7
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