Cryogenic packaging for multi-GHz electronics

被引：11

作者：

Tighe, TS ^{[1
]}

Akerling, G ^{[1
]}

Smith, AD ^{[1
]}

机构：

[1] TRW Co Inc, Space & Elect Grp, Redondo Beach, CA 90278 USA

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 1999年 / 9卷 / 02期

关键词：

D O I：

10.1109/77.783703

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To meet the packaging needs of current superconducting electronics, we have developed high speed multi-chip modules (MCMs), flexible ribbon cabling, and press-contact surface mounts. We describe these new technologies and include techniques for high-reliability, high-yield assembly. In addition, we present electrical and thermal characterizations of a system which incorporates these new technologies. Electrical characterization includes multi-GHz insertion loss and digital-data transmission measurements. We have performed extensive thermal modeling using SINDA software and have experimentally verified these simulations. We present the results and their general applicability to these new cryogenic packaging technologies.

引用

页码：3173 / 3176

页数：4

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