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Nano/micro-scale surface modifications using copper oxidation for enhancement of surface wetting and falling-film heat transfer
被引:42
|作者:
Koeroglu, Batikan
[1
]
Lee, Kee Sung
[1
,2
]
Park, Chanwoo
[1
]
机构:
[1] Univ Nevada, Dept Mech Engn, Reno, NV 89557 USA
[2] Kookmin Univ, Sch Mech Syst Engn, Seoul 136702, South Korea
关键词:
Copper oxide;
Chemical immersion;
Surface wetting;
Contact angle;
Nano and micro-scale surface morphology;
Falling-film evaporation;
HORIZONTAL-TUBE;
OXIDE;
MICROSCALE;
D O I:
10.1016/j.ijheatmasstransfer.2013.03.040
中图分类号:
O414.1 [热力学];
学科分类号:
摘要:
The copper oxidation in NaOH aqueous solutions by a chemical immersion method was used to create nano/micro-scale surface morphology on heat transfer surfaces and control their liquid wettability. Different oxidation conditions, depending on nano/micro-scale surface morphologies, created hydrophilic surfaces (contact angle <90 degrees) with nano-whisker structures of CuO, and hydrophobic surfaces (contact angle >90 degrees) with nano/micro-crystal structures of Cu2O. A heat transfer experiment using a horizontal-tube, falling-film evaporator was performed to study the effect of the nano/micro-scale surface morphology of the evaporator tubes on surface wetting and heat transfer. The surface wetting and heat transfer performance of three different evaporators of plain (untreated), oxidized, and porous-layer coated tubes were compared. (C) 2013 Elsevier Ltd. All rights reserved.
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页码:794 / 804
页数:11
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