Pulse Electrodeposition of Ni-W Alloy for Trench Filling in Microelectromechanical Systems

被引：3
|
作者：
Jung, Hayong [1 ]
Hong, Chan [1 ]
Ki, Junghee [1 ]
Kim, Jutae [1 ]
Kim, Bonghan [2 ]
Tak, Yongsug [1 ]
机构：
[1] Inha Univ, Dept Chem Engn, Inchon 402751, South Korea
[2] Seoul Natl Univ, Sch Elect Engn, Seoul, South Korea
来源：
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | 2008年 / 8卷 / 10期
关键词：
Electrodeposition; MEMS (Microelectromechanical System); Ni-W; Trench;
D O I：
10.1166/jnn.2008.1189
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
The effect of pulse current (PC) on Ni-W alloy electrodeposition was investigated to fill the trenches with aspect ratio 1:2 for MEMS applications. Rapid deposition of top side in trench produced a void in electrodeposits with direct current (DC). Morphology of Ni-W electrodeposition inside trench was strongly influenced by the applied current density and the current off-time (t(off)). Enhanced filling phenomena were observed with increasing current off-time because of decreasing concentration gradient between top and bottom in trench. The complete Ni-W filling of trench was achieved with a current density of 200 mA/cm(2) and a current on- and off-time of 100 ms and 300 ms, respectively. Amorphous structure was revealed in both DC and PC electrodeposits and the concentration of W in Ni-W electrodeposits for complete filling of trench was about 24% in atomic ratio.
引用
收藏
页码：5321 / 5325
页数：5
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