Pulse Electrodeposition of Ni-W Alloy for Trench Filling in Microelectromechanical Systems

被引：3
|
作者：
Jung, Hayong [1 ]
Hong, Chan [1 ]
Ki, Junghee [1 ]
Kim, Jutae [1 ]
Kim, Bonghan [2 ]
Tak, Yongsug [1 ]
机构：
[1] Inha Univ, Dept Chem Engn, Inchon 402751, South Korea
[2] Seoul Natl Univ, Sch Elect Engn, Seoul, South Korea
来源：
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | 2008年 / 8卷 / 10期
关键词：
Electrodeposition; MEMS (Microelectromechanical System); Ni-W; Trench;
D O I：
10.1166/jnn.2008.1189
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
The effect of pulse current (PC) on Ni-W alloy electrodeposition was investigated to fill the trenches with aspect ratio 1:2 for MEMS applications. Rapid deposition of top side in trench produced a void in electrodeposits with direct current (DC). Morphology of Ni-W electrodeposition inside trench was strongly influenced by the applied current density and the current off-time (t(off)). Enhanced filling phenomena were observed with increasing current off-time because of decreasing concentration gradient between top and bottom in trench. The complete Ni-W filling of trench was achieved with a current density of 200 mA/cm(2) and a current on- and off-time of 100 ms and 300 ms, respectively. Amorphous structure was revealed in both DC and PC electrodeposits and the concentration of W in Ni-W electrodeposits for complete filling of trench was about 24% in atomic ratio.
引用
收藏
页码：5321 / 5325
页数：5
相关论文
共 50 条
  • [1] Pulse electrodeposition and characterization of nano Ni-W alloy deposits
    Kumar, K. Arunsunai
    Kalaignan, G. Paruthimal
    Muralidharan, V. S.
    [J]. APPLIED SURFACE SCIENCE, 2012, 259 : 231 - 237
  • [2] Pulse current electrodeposition and corrosion properties of Ni-W alloy coatings
    Zemanova, M.
    Krivosudska, M.
    Chovancova, M.
    Jorik, V.
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 2011, 41 (09) : 1077 - 1085
  • [3] Electrodeposition of Ni-W Alloy in Sulphate System
    [J]. Hu, Hui-Li, 1600, Chongqing Wujiu Periodicals Press (46):
  • [4] Pulse plating effects during Ni-W electrodeposition
    Lee, SL
    Lee, YF
    Chang, MH
    Lin, JC
    [J]. CORROSION PREVENTION & CONTROL, 1999, 46 (03): : 71 - 76
  • [5] Electrodeposition of Ni-W Amorphous Alloy and Ni-W-SiC Composite Deposits
    Zhongcheng GUO
    [J]. Journal of Materials Science & Technology, 2000, (03) : 323 - 326
  • [6] Electrodeposition of Ni-W amorphous alloy and Ni-W-SiC composite deposits
    Guo, ZC
    Zhu, XY
    Zhai, DC
    Yang, XW
    [J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2000, 16 (03) : 323 - 326
  • [7] Electrodeposition, structure and corrosion resistance of nanocrystalline Ni-W alloy
    Yang, FZ
    Guo, YF
    Huang, L
    Xu, SK
    Zhou, SM
    [J]. CHINESE JOURNAL OF CHEMISTRY, 2004, 22 (03) : 228 - 231
  • [8] Electrodeposition of laminar coatings of Ni-W alloy and their corrosion behaviour
    Elias, Liju
    Hegde, A. Chitharanjan
    [J]. SURFACE & COATINGS TECHNOLOGY, 2015, 283 : 61 - 69
  • [9] Pulse electrodeposition and corrosion behavior of Ni-W/MWCNT nanocomposite coatings
    Li, Han
    He, Yi
    Fan, Yi
    Xu, Wei
    Yang, Qiangbin
    [J]. RSC ADVANCES, 2015, 5 (84): : 68890 - 68899
  • [10] Effect of Electrodeposition Current and Pulse Parameter on Surface Mechanical and Electrochemical Behavior of Ni-W Alloy Coatings
    Kolle, Mahesh Kumar
    Shajahan, Shaik
    Basu, A.
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2020, 51 (07): : 3721 - 3731
12345