Semi-Serial On-Chip Link Implementation for Energy Efficiency and High Throughput

被引:4
|
作者
Nigussie, Ethiopia [1 ]
Tuuna, Sampo [1 ]
Plosila, Juha [1 ]
Isoaho, Jouni [1 ]
Tenhunen, H. [1 ]
机构
[1] Univ Turku, Dept Informat Technol, Turku 20014, Finland
基金
芬兰科学院;
关键词
Differential current-mode signaling; network-on-chip (NoC); pulse signaling; self-timed delay-insensitive communication; wave-pipelining; INTERCONNECT; OPTIMIZATION; CHALLENGES; DRIVER;
D O I
10.1109/TVLSI.2011.2170228
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A high-throughput and low-energy semi-serial on-chip communication link based on novel design techniques and circuit solutions is presented. This self-timed link is designed using high-speed serialization/deserializtion and pulse dual-rail encoding techniques. The link also employs wave-pipelined differential pulse current-mode signaling to maintain the high speed data intake from the serializer. The energy efficiency of the proposed semi-serial link, which consists of bit-serial links in parallel, mainly comes from the sharing of the novel serializer's control circuit among the bit-serial links. In addition, the integration of pulse signaling with wave-pipelining, the use of a new low-complexity data validity detection technique, and the avoidance of data decoding logic also contribute to the power reduction. Furthermore, the formulated pulse dual-rail encoding provides an opportunity to implement pulse signaling at no cost. The ability to detect data validity at bit level allows acknowledgment per word without losing the delay-insensitivity of the transmission. The proposed semi-serial link is analyzed and compared with bit-serial and fully bit-parallel links for 64-bit data and communication distances of 1 to 8 mm. The semi-serial link which consists of eight bit-serial links provides 72.72 Gbps throughput with 286 fJ/bit energy dissipation for 8 mm transmission. It dissipates the lowest energy per bit compared to fully bit-parallel links while achieving the same throughput. The links are designed and simulated in Cadence Analog Spectre using 65-nm technology from STMicroelectronics.
引用
收藏
页码:2265 / 2277
页数:13
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