Simulation of the Pore Formation at Grain Boundaries in Aluminum

被引:4
|
作者
Weckman, A., V [1 ]
Dem'yanov, B. F. [1 ]
机构
[1] Polzunov Altai State Tech Univ, Barnaul 656038, Russia
关键词
PRESSURE; VACANCIES; EVOLUTION; GROWTH; COPPER; CREEP;
D O I
10.1134/S0021364020110119
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
The possibility of the pore formation at the tilt grain boundaries with the [100] misorientation axis is studied by computer simulation methods. Three special boundaries and three grain boundaries of a general type are studied at temperatures of 400, 500, and 600 K. It is shown that the presence of 3% lattice vacancies is insufficient for the pore formation both at the grain boundary and in grains, whereas in the presence of 6% lattice vacancies, pores are formed only in grains. Pores on grain boundaries are formed at temperatures of 500 and 600 K with a lattice vacancy concentration of 4 and 5%, respectively. Pores are not formed on a special grain boundary sigma 5(013).
引用
收藏
页码:643 / 646
页数:4
相关论文
共 50 条
  • [31] Energies of [001] small angle grain boundaries in aluminum
    A. Otsuki
    Journal of Materials Science, 2005, 40 : 3219 - 3223
  • [32] Evolution of Grain Boundaries in Aluminum during Isothermal Annealing
    Sursaeva, V.G.
    Russian Metallurgy (Metally), 2024, 2024 (02) : 257 - 263
  • [33] Texture, grain boundaries and deformation of superplastic aluminum alloys
    Pérez-Prado, MT
    McNelley, TR
    González-Doncel, G
    Ruano, OA
    SUPERPLASTICITY IN ADVANCED MATERIALS, ICSAM-2000, 2001, 357-3 : 255 - 260
  • [34] Energies of [001] small angle grain boundaries in aluminum
    Otsuki, A
    JOURNAL OF MATERIALS SCIENCE, 2005, 40 (12) : 3219 - 3223
  • [35] KINETICS OF RECOVERY ON GRAIN-BOUNDARIES IN POLYCRYSTALLINE ALUMINUM
    KWIECINSKI, J
    WYRZYKOWSKI, JW
    ACTA METALLURGICA, 1989, 37 (05): : 1503 - 1507
  • [36] SLIP BAND CONTINUITY ACROSS GRAIN BOUNDARIES IN ALUMINUM
    DAVIS, KG
    TEGHTSOO.E
    LU, A
    ACTA METALLURGICA, 1966, 14 (12): : 1677 - &
  • [37] Aluminum Nanotransmission Lines with No Grain Boundaries and No Surface Roughness
    Kang, Myunggil
    Lee, Jongwoon
    Hwang, Donghoon
    Kim, Byung-Sung
    Hong, Byunghak
    Whang, Dongmok
    Hwang, Sungwoo
    APPLIED PHYSICS EXPRESS, 2011, 4 (06)
  • [38] ELECTROMIGRATION OF GRAIN-BOUNDARIES IN ALUMINUM (99.995 PERCENT)
    PIERI, JC
    NIAZI, A
    JOUTY, R
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1975, 27 (02): : 383 - 391
  • [39] STRENGTH BEHAVIOR OF GRAIN-BOUNDARIES IN CASTED ALUMINUM
    SATTLER, HP
    METALL, 1977, 31 (06): : 599 - 603
  • [40] INFLUENCE OF GRAIN-BOUNDARIES ON THE SUBSTRUCTURE OF POLYGONIZATION IN ALUMINUM
    ALYOSHIN, AN
    BERNSHTEYN, ML
    LEBEDEV, AG
    FIZIKA METALLOV I METALLOVEDENIE, 1986, 62 (06): : 1171 - 1174