Study on Preparation of High-k Organic-Inorganic Thin Film for Organic-Inorganic Thin Film Transistor Gate Dielectric Application

A simple solution-based deposition technique combined with spin-coating is a plausible way to prepare ultra-thin organic-inorganic nanocomposite films. In this study, we describe the spin-coating deposition of a colloidal nanoparticle suspension to obtain an ultra-thin organic-inorganic composite film as a gate insulator for organic thin film transistor (O-TFT) application. To obtain a homogenous organic-inorganic composite film, well-dispersed TiO2 nanoparticles in gamma-butyrolactone and polyimide are important; therefore, several dispersants were assessed on the basis of the measurement of the rheological behavior of slurries. The thickness of the organic-inorganic composite film is mainly determined by the speed of spin-coating and viscosity of slurries. An approximately 4000-angstrom-thick nanocomposite film with homogeneous distribution of TiO2 nanoparticles in polyimide and low roughness was obtained after curing at 200 degrees C, resulting in a low leakage current density of the nano-composite film, when less than 2 vol % TiO2 nanoparticles were well dispersed in polyimide slurry. The dielectric constant of the organic-inorganic nanocomposite increases with increasing TiO2 content in polyimide, being situated in the range between 4 and 5. (c) 2012 The Japan Society of Applied Physics