Secure and Energy-Efficient Interconnects for Board-to-Board Communication

被引:0
|
作者
Matthiesen, Bho [1 ]
Pfennig, Stefan [1 ]
Bielert, Mario [1 ]
Ilsche, Thomas [1 ]
Lonnstrom, Andrew [1 ]
Li, Tao [1 ]
Cabrera, Juan A. [1 ]
Scheunert, Christian [1 ]
Franz, Elke [1 ]
Santini, Silvia [2 ]
Strufe, Thorsten [1 ]
Jorswieck, Eduard A. [1 ]
Nagel, Wolfgang E. [1 ]
Nguyen, Giang T. [1 ]
Fitzek, Frank H. Y. [1 ]
机构
[1] Tech Univ Dresden, SFB HAEC 912, Dresden, Germany
[2] Univ Svizzera Italiana, Lugano, Switzerland
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To meet the consistently increasing computation demand while reducing the energy footprint, future computing architectures need to consider parallelism. In this paradigm, compute nodes with massive number of cores are directly interconnected in one board by short-range optical connections. At the same time, high-speed wireless connections of up to 100 Clips are used on demand between compute nodes of different boards. That hybrid design not only enables flexibility and energy efficiency but also opens up new research questions to obtain secure and energy-efficient interconnects in various areas, such as communications, routing, distributed storage and especially security. This paper summarizes the state-of-the-art research findings in those areas, presents a novel key distribution scheme and expands current evaluation platforms with a novel testbed design and realization, leveraging the maturity of virtualization technologies.
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页数:7
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