Electroforming Process in Metal-Oxide-Polymer Resistive Switching Memories

被引:0
|
作者
Chen, Qian [1 ]
Gomes, Henrique L. [1 ]
Kiazadeh, Asal [1 ]
Rocha, Paulo R. F. [1 ]
De Leeuw, Dago M. [2 ]
Meskers, Stefan C. J. [3 ]
机构
[1] Univ Algarve, CEOT, Campus Gambelas, P-8000139 Faro, Portugal
[2] Philips Res Labs, NL-5656 AE Eindhoven, Netherlands
[3] Eindhoven Univ Technol, Mol Mat & Nanosyst, NL-5600 MB Eindhoven, Netherlands
关键词
Resistive Random Access Memory (RRAM); electroforming soft-breakdown; non-volatile memory; NEGATIVE-RESISTANCE; THIN-FILMS; CONDUCTION; BREAKDOWN; CHARGE; OXYGEN; AL2O3; SIO2;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Electroforming, of an Al/Al2O3/polymer/Al resistive switching diode is reported. Electroforming is a dielectric soft-breakdown mechanism leading to hysteretic current-voltage characteristics and non-volatile memory behavior. Electron trapping occurs at early stages of electroforming. Trapping is physically located at the oxide/polymer interface. The detrapping kinetics is faster under reverse bias and for thicker oxides layers. Thermally detrapping experiments give a trap depth of 0.65 eV and a density of 5x10(17)/cm(2). It is proposed that the trapped electrons induce a dipole layer across the oxide. The associated electric field triggers breakdown and ultimately dictate the overall memory characteristics.
引用
收藏
页码:527 / +
页数:2
相关论文
共 50 条
  • [21] Unipolar resistive switching in metal oxide/organic semiconductor non-volatile memories as a critical phenomenon
    Bory, Benjamin F.
    Rocha, Paulo R. F.
    Gomes, Henrique L.
    de Leeuw, Dago M.
    Meskers, Stefan C. J.
    [J]. JOURNAL OF APPLIED PHYSICS, 2015, 118 (20)
  • [22] Transient characterization of the electroforming process in TiO2 based resistive switching devices
    Noman, Mohammad
    Sharma, Abhishek A.
    Lu, Yi Meng
    Skowronski, Marek
    Salvador, Paul A.
    Bain, James A.
    [J]. APPLIED PHYSICS LETTERS, 2013, 102 (02)
  • [23] Chemical insight into electroforming of resistive switching manganite heterostructures
    Borgatti, Francesco
    Park, Chanwoo
    Herpers, Anja
    Offi, Francesco
    Egoavil, Ricardo
    Yamashita, Yoshiyuki
    Yang, Anli
    Kobata, Masaaki
    Kobayashi, Keisuke
    Verbeeck, Jo
    Panaccione, Giancarlo
    Dittmann, Regina
    [J]. NANOSCALE, 2013, 5 (09) : 3954 - 3960
  • [24] Amorphous-Si-Based Resistive Switching Memories with Highly Reduced Electroforming Voltage and Enlarged Memory Window
    Qian, Kai
    Viet Cuong Nguyen
    Chen, Tupei
    Lee, Pooi See
    [J]. ADVANCED ELECTRONIC MATERIALS, 2016, 2 (04):
  • [25] Resistive switching memories based on metal oxides: mechanisms, reliability and scaling
    Ielmini, Daniele
    [J]. SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2016, 31 (06)
  • [26] The Role of Ti Buffer Layer Thickness on the Resistive Switching Properties of Hafnium Oxide-Based Resistive Switching Memories
    Raharnan, Sk. Ziaur
    Lin, Yu-De
    Lee, Heng-Yuan
    Chen, Yu-Sheng
    Chen, Pang-Shiu
    Chen, Wei-Su
    Hsu, Chien-Hua
    Tsai, Kan-Hsueh
    Tsai, Ming-Jinn
    Wang, Pei-Hua
    [J]. LANGMUIR, 2017, 33 (19) : 4654 - 4665
  • [27] Unipolar resistive switching in insulating niobium oxide film and probing electroforming induced metallic components
    Jung, Kyooho
    Kim, Yongmin
    Park, Young S.
    Jung, Woong
    Choi, Jungae
    Park, Baeho
    Kim, Hyungsang
    Kim, Wondong
    Hong, Jinpyo
    Im, Hyunsik
    [J]. JOURNAL OF APPLIED PHYSICS, 2011, 109 (05)
  • [28] Nanoionic Resistive Switching Memories: On the Physical Nature of the Dynamic Reset Process
    Marchewka, Astrid
    Roesgen, Bernd
    Skaja, Katharina
    Du, Hongchu
    Jia, Chun-Lin
    Mayer, Joachim
    Rana, Vikas
    Waser, Rainer
    Menzel, Stephan
    [J]. ADVANCED ELECTRONIC MATERIALS, 2016, 2 (01):
  • [29] Electroforming free high resistance resistive switching of graphene oxide modified polar-PVDF
    Thakre, Atul
    Borkar, Hitesh
    Singh, B. P.
    Kumar, Ashok
    [J]. RSC ADVANCES, 2015, 5 (71) : 57406 - 57413
  • [30] Metal oxide resistive switching memory: Materials, properties and switching mechanisms
    Kumar, D.
    Aluguri, R.
    Chand, U.
    Tseng, T. Y.
    [J]. CERAMICS INTERNATIONAL, 2017, 43 : S547 - S556