Mathematical Modeling of the Electrodeposition Process

被引：1
|
作者：
Mahapatro, Anil [1 ,2 ]
Suggu, Santosh Kumar [2 ]
机构：
[1] Wichita State Univ, Bioengn, Wichita, KS 67260 USA
[2] Wichita State Univ, Dept Ind & Mfg Engn, Wichita, KS 67260 USA
来源：
STUDENT POSTERS (GENERAL) - 225TH ECS MEETING | 2014年 / 61卷 / 26期
关键词：
SIMULATION;
D O I：
10.1149/06126.0023ecst
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Electroplating or electrodeposition is a process which produces a dense, uniform and adherent coating on a metal surface using electric current in an electrolytic cell. This process is mainly used to change the surface properties of a material. It is used for many technological applications, like automotive industries, electrical industries, corrosion protection of metals etc. Modeling of the electrodeposition process will assist in minimizing experimental trials for optimization of these coating strategies. In this manuscript we report the development of a mathematical model to simulate the electrodeposition of copper on cobalt-chrome alloy. The developed model was validated using experiments.
引用
收藏
页码：23 / 29
页数：7
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