共 50 条
- [23] System design issues for harsh environment electronics employing metal-backed laminate substrates IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (01): : 74 - 85
- [30] Damage mechanics of electronics on metal-backed substrates in harsh environments IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (01): : 204 - 212