Product Quality Prediction using Alarm data : Application to the Semiconductor manufacturing process

被引:0
|
作者
Melhem, Mariam [1 ]
Ananou, Bouchra [1 ]
Ouladsine, Mustapha [1 ]
Combal, Michel [2 ]
Pinaton, Jacques [2 ]
机构
[1] Aix Marseille Univ, Univ Toulon, CNRS, ENSAM,LSIS, Marseille, France
[2] ST Microelect, Proc Control Dept, Rousset, France
关键词
REGRESSION; MACHINE; PLASMA;
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In the complex manufacturing processes, high quantity of products might be rejected. This can be due to the no detected failures. To evaluate the processing of manufacturing steps, alarms are setting off to indicate failures. However, industrial plant operators often receive many more alarms than they can manage, which include correlation. A poor alarm system may cause nuisance alarms and thus alarm floods, which reduces the ability of operators to take actions. This paper aims to identify unnecessary alarms within a large amount of event data. We prove the equivalence between similarity approaches in case of sparse binary data. The second purpose of this paper is the product quality prediction based on historical alarm events by using a regularized regression method. To demonstrate the effectiveness of these tools and their utility in the product quality prediction, we present an industrial case study based on alarm and scrap data collected from a semiconductor manufacturing process. Application results show the practicality and utility of the proposed methodology for both alarm management and product quality prediction.
引用
收藏
页码:1332 / 1338
页数:7
相关论文
共 50 条
  • [41] Data mining using genetic programming for construction of a semiconductor manufacturing yield rate prediction system
    Li, TS
    Huang, CL
    Wu, ZY
    JOURNAL OF INTELLIGENT MANUFACTURING, 2006, 17 (03) : 355 - 361
  • [42] Early-stage product quality prediction and Di scrimination by using multivariate analysis based on software process data
    Fukuta, Atsushi
    Yamada, Shigeru
    Fukushima, Toshihiko
    ICIM 2006: PROCEEDINGS OF THE EIGHTH INTERNATIONAL CONFERENCE ON INDUSTRIAL MANAGEMENT, 2006, : 15 - 21
  • [43] Dynamic risk analysis using alarm databases to improve process safety and product quality: Part IIuBayesian analysis
    Pariyani, Ankur
    Seider, Warren D.
    Oktem, Ulku G.
    Soroush, Masoud
    AICHE JOURNAL, 2012, 58 (03) : 826 - 841
  • [44] Dynamic risk analysis using alarm databases to improve process safety and product quality: Part IuData compaction
    Pariyani, Ankur
    Seider, Warren D.
    Oktem, Ulku G.
    Soroush, Masoud
    AICHE JOURNAL, 2012, 58 (03) : 812 - 825
  • [45] An approach to monitoring quality in manufacturing using supervised machine learning on product state data
    Thorsten Wuest
    Christopher Irgens
    Klaus-Dieter Thoben
    Journal of Intelligent Manufacturing, 2014, 25 : 1167 - 1180
  • [46] An approach to monitoring quality in manufacturing using supervised machine learning on product state data
    Wuest, Thorsten
    Irgens, Christopher
    Thoben, Klaus-Dieter
    JOURNAL OF INTELLIGENT MANUFACTURING, 2014, 25 (05) : 1167 - 1180
  • [47] A new method for wafer quality monitoring using semiconductor process big data
    Sohn, Younghoon
    Lee, Hyun
    Yang, Yusin
    Jun, Chungsam
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXXI, 2017, 10145
  • [48] Big Data Emergence in Semiconductor Manufacturing Advanced Process Control
    Moyne, James
    Samantaray, Jamini
    Armacost, Mike
    2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), 2015, : 130 - 135
  • [49] Development of a framework for analyzing process monitoring data with applications to semiconductor manufacturing process
    Yoon, YH
    Kim, YS
    Kim, SJ
    Yum, BJ
    COMPSTAT 2002: PROCEEDINGS IN COMPUTATIONAL STATISTICS, 2002, : 297 - 302
  • [50] Deep Learning of Complex Batch Process Data and Its Application on Quality Prediction
    Wang, Kai
    Gopaluni, Ratna Bhushan
    Chen, Junghui
    Song, Zhihuan
    IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2020, 16 (12) : 7233 - 7242