Test vehicle for studying thermal conductivity of die attach adhesives for high temperature electronics

被引：0
|
作者：
Slater, Conor [1 ]
Vecchio, Fabrizio [1 ]
Maeder, Thomas [1 ]
Ryser, Peter [1 ]
机构：
[1] Ecole Polytech Fed Lausanne, Lab Prod Microtech, CH-1015 Lausanne, Switzerland
来源：
ADVANCED MATERIALS AND STRUCTURES IV | 2012年 / 188卷
关键词：
Die Attach; Thermal Conductivity; High Temperature; Electronics;
D O I：
10.4028/www.scientific.net/SSP.188.238
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of degradation of polymers. It consists of a mock die that has an integrated thick film heater, which is mounted onto a substrate. In operation, the substrate is placed on a heatsink and the die is heated. When the temperature reaches equilibrium the heater is switched off and the temperature of the die is measured as it cools. The time constant of the temperature decay is calculated to give the thermal conductivity. In this paper the thermal conductivity of an epoxy die attach adhesive is compared to its shear strength.
引用
收藏
页码：238 / 243
页数：6
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