Prototype development for chip-chip interconnection by multimode waveguide

被引：0

作者：

Pong, BLS ^{[1
]}

Pamidigantham, R ^{[1
]}

Premachandran, CS ^{[1
]}

机构：

[1] Star Inst Microelect, IME, Singapore 117685, Singapore

来源：

PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2 | 2005年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A low cost multimode polymer waveguide has been developed for chip to chip communications application. Due to the application is design for short distance communications, 850 nm wavelength is chosen in this case. We have chosen SU 8 as the core waveguide due to its highly transparent in 850 nm range with high thermal stabilities of > 200 degree C and low moisture intakes. A propagation loss of less than 1 dB/cm at 850nm has been achieved by using a cut back method. Optical measurements found that no change in the propogation loss after going through standard reflow temperature profile used for Printed circuit board (PCB).

引用

页码：488 / 491

页数：4

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