Electro-Thermo-Mechanical Beam Model

被引:0
|
作者
Chigullapalli, Aarti [1 ,3 ]
Clark, Jason V. [1 ,2 ,3 ]
机构
[1] Purdue Univ, Sch Mech Engn, W Lafayette, PA 47907 USA
[2] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, PA USA
[3] Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, PA USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we present our compact electro-thermo-mechanical beam model. Compact models are important for efficiently modeling parametric performances of a large number of multicomponent systems. There are some finite element analysis tools like COMSOL, Intellisense and lumped models in Sugar, Coventoreware that can model and simulate thermodynamic phenomena's. But what is new about our compact model is that along with the features offered by the above models, ours can support energy exchange by radiation or between itself and neighboring components. Our compact model considers mechanical beams subject to various energy transfer mechanisms, properties, and boundary conditions. Energy transfer mechanisms can include: conduction, convection to ambient, radiation due to the radiation source, and interaction with the substrate. Thermal expansion is determined by computing the average temperature of the beam and by applying equivalent end node forces to elongate the beam. As a test case we model the deflection of a U-shaped thermal actuator subject to all the energies listed above. The results compare well with experiment.
引用
收藏
页码:243 / 246
页数:4
相关论文
共 50 条
  • [21] Electromigration Analysis and Electro-Thermo-Mechanical Design for Semiconductor Package
    Hsu, Hsiang-Chen
    Ju, Shen-Wen
    Lu, Jie-Rong
    Chang, Hong-Shen
    Wu, Hong-Hau
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 1032 - 1037
  • [22] Electro-thermo-mechanical analytical modeling of multilayer cantilever microactuator
    Jiang, Jianliang
    Hilleringmann, Ulrich
    Shui, Xiaoping
    SENSORS AND ACTUATORS A-PHYSICAL, 2007, 137 (02) : 302 - 307
  • [23] Dynamic Modeling Method of Electro-Thermo-Mechanical Degradation in IGBT Modules
    Pedersen, Kristian Bonderup
    Pedersen, Kjeld
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2016, 31 (02) : 975 - 986
  • [24] Electro-thermo-mechanical stress analysis of smart sandwich cylindrical shell
    Zhou, Yuhua
    Khadimallah, Mohamed Amine
    Allahyari, Seyedmahmoodreza
    Behshad, Amir
    STEEL AND COMPOSITE STRUCTURES, 2021, 40 (05): : 723 - 732
  • [25] Electro-thermo-mechanical modeling of GaN-based HFETs and MOSHFETs
    Venkatachalam, A.
    James, W. T.
    Graham, S.
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2011, 26 (08)
  • [26] Electro-thermo-mechanical coupling in carbon fiber polymer matrix composites
    Zhupanska, Olesya I.
    Sierakowski, Robert L.
    ACTA MECHANICA, 2011, 218 (3-4) : 319 - 332
  • [27] Experimental validation of a numerical multiphysics technique for electro-thermo-mechanical problem
    Delprete, Cristiana
    Freschi, Fabio
    Repetto, Maurizio
    Rosso, Carlo
    COMPEL-THE INTERNATIONAL JOURNAL FOR COMPUTATION AND MATHEMATICS IN ELECTRICAL AND ELECTRONIC ENGINEERING, 2010, 29 (06) : 1642 - 1652
  • [28] Electro-thermo-mechanical coupling in carbon fiber polymer matrix composites
    Olesya I. Zhupanska
    Robert L. Sierakowski
    Acta Mechanica, 2011, 218 : 319 - 332
  • [29] Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics
    Gschwandl, Mario
    Friedrich, Birgit
    Pfost, Martin
    Antretter, Thomas
    Fuchs, Peter Filipp
    Mitev, Ivaylo
    Tao, Qi
    Schingale, Angelika
    MICROELECTRONICS RELIABILITY, 2022, 133
  • [30] Experimental Characterization of Electro-Thermo-Mechanical Coupling in Gold RF Microswitches
    Brusa, Eugenio
    De Pasquale, Giorgio
    Soma, Aurelio
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2013, 22 (04) : 919 - 929