Low power GaAs current-mode 1.2 Gb/s interchip interconnections

被引：17
|
作者：
Long, SI [1 ]
Zhang, JQ [1 ]
机构：
[1] HEWLETT PACKARD CORP,FT COLLINS,CO 80525
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1997年 / 32卷 / 06期
关键词：
current-mode interconnections; feedback circuits; integrated circuit desing; integrated circuit interconnections; logic design; multichip modules; very-high-speed integrated circuits;
D O I：
10.1109/4.585291
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new GaAs current-mode (CM) chip-to-chip interconnection circuit is presented that provides high signal transfer speed with a 50 Omega active termination and reduced input voltage swing, The power dissipation is shown to be 1/8 of an ECL I/O at the same data rate, 4 mW per pin, using a standard 2 V power supply, The driver-receiver operates with a current swing under 1 mA and provides a large noise margin.
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页码：890 / 897
页数：8
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