Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates

被引：15

作者：

Yen, Yee-Wen ^{[1
]}

Hsieh, Yu-Ping ^{[1
]}

Jao, Chien-Chung ^{[2
]}

Chiu, Chao-Wei ^{[1
]}

Li, Yi-Shan ^{[1
]}

机构：

[1] Natl Taiwan Univ Sci & Technol, Dept Mat Sci & Engn, Taipei 106, Taiwan

[2] Ta Hwa Inst Technol, Dept Appl Technol Living, Hsinchu 30703, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2014年 / 43卷 / 01期

关键词：

Sn; Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC); Sn-9 wt.%Zn (SZ) Fe-42 wt.%Ni (alloy 42); diffusion-controlled; PB-FREE SOLDERS; THERMODYNAMIC ASSESSMENT; GROWTH-KINETICS; ZN SYSTEM; NI; ALLOYS; AG; CU;

D O I：

10.1007/s11664-013-2727-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Interfacial reactions between Sn, Sn-3.0 wt.%Ag-0.5 wt.%Cu (SAC), and Sn-9 wt.%Zn (SZ) lead-free solders and Fe-42 wt.%Ni (alloy 42) substrates at 240A degrees C, 255A degrees C, and 270A degrees C were investigated in this study. FeSn2, (Fe,Ni, Cu)Sn-2, and (Ni,Fe)(5)Zn-21 phases were formed, respectively, at the interface in the Sn/alloy 42, SAC/alloy 42, and SZ/alloy 42 couples. As the reaction time and temperature were increased, the layered intermetallic compound (IMC) assumed two distinct structures, i.e., a thicker layer and a pillar-shaped IMC, in all couples. The IMC thickness of these couples increased with the increase of reaction time and temperature. The IMC thickness was also proportional to the square root of the reaction time. The interfacial reaction mechanism of these couples was diffusion controlled.

引用

页码：187 / 194

页数：8

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