Thin film stress and texture analysis at the MCX synchrotron radiation beamline at ELETTRA

被引：2
|
作者：
Ortolani, Matteo [1 ]
Ricardo, Cristy Leonor Azanza [1 ]
Lausi, Andrea [2 ]
Scardi, Paolo [1 ]
机构：
[1] Univ Trento, Dept Mat Engn & Ind Technol, Via Mesiano 77, I-38123 Trento, Italy
[2] ELETTRA Sincrotrone Trieste, I-34149 Basovizza, Trieste, Italy
来源：
RESIDUAL STRESSES VIII | 2011年 / 681卷
关键词：
X-ray diffraction; residual stress; texture analysis; synchrotron radiation; thin films; STRAINS;
D O I：
10.4028/www.scientific.net/MSF.681.115
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The main instrumental characteristics of MCX, the new beamline at the Italian synchrotron Elettra in Trieste, are presented. Design and geometrical set-up are well suited to the Xray diffraction stress and texture analysis of thin films and surfaces, and are such to guarantee a full control of the main instrumental errors. Besides exploiting the typical features of synchrotron radiation, like high brilliance, tuneable beam energy and optimal beam geometry. MCX can also host tools for in-situ studies, like X-ray diffraction during four point bending. A few examples of current applications are shown.
引用
收藏
页码：115 / +
页数：2
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