Single Photon Counting Integrated Circuit Operating with CdTe Pixel Detector

被引:0
|
作者
Maj, Piotr [1 ]
Grybos, Pawel [1 ]
Kmon, Piotr [1 ]
Szczygiel, Robert [1 ]
机构
[1] AGH Univ Sci & Technol, Krakow, Poland
关键词
integrated circuits; X-ray detectors; CHIP;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
CdTe detectors are very good candidate for medical X-ray imaging applications, because of their relatively high atomic number and significant progress in their fabrication process during the last decade. For this reason we built a hybrid pixel detector based on CdTe sensor and the UFXC32k integrated circuit designed in CMOS 130 nrn process and operating in a single photon counting mode. The core of the IC is the matrix of 128 x 256 square shaped pixels of 75 mu m pitch. Each pixel contains a charge sensitive amplifier, a shaper, a discriminator, correction circuits and two 14-bit counters. The UFXC32k chip was bump-bonded to a pixel CdTe sensor and characterized using X-ray radiation. The measured equivalent noise charge is equal to 125 e- rms for the gain of 33 mu V/e-. Thanks to a good quality of hump-bonding process we also managed to obtain a satisfactory X-ray radiograms.
引用
收藏
页码:324 / 327
页数:4
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