100 mm 4HN-SiC Wafers with Zero Micropipe Density

被引:50
|
作者
Leonard, R. T. [1 ]
Khlebnikov, Y. [1 ]
Powell, A. R. [1 ]
Basceri, C. [1 ]
Brady, M. F. [1 ]
Khlebnikov, I. [1 ]
Jenny, J. R. [1 ]
Malta, D. P. [1 ]
Paisley, M. J. [1 ]
Tsvetkov, V. F. [1 ]
Zilli, R. [1 ]
Deyneka, E. [1 ]
Hobgood, H. McD. [1 ]
Balakrishna, V. [1 ]
Carter, C. H., Jr. [1 ]
机构
[1] Cree Inc, Durham, NC 27703 USA
关键词
4HN-SiC; silicon carbide; SiC; PVT; seeded sublimation; crystal; substrate; wafer; diameter; micropipe; dislocation; defects; SINGLE-CRYSTAL;
D O I
10.4028/www.scientific.net/MSF.600-603.7
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Recent advances in PVT c-axis growth process have shown a path for eliminating micropipes in 4HN-SiC, leading to the demonstration of zero micropipe density 100 mm 4HN-SiC wafers. Combined techniques of KOH etching and cross-polarizer inspections were used to confirm the absence of micropipes. Crystal growth studies for 3-inch material with similar processes have 2 demonstrated a 1c screw dislocation median density of 175 cm(-2), compared to typical densities of 2x10(3) to 4x10(3) cm(-2) in current production wafers. These values were obtained through optical scanning analyzer methods and verified by x-ray topography.
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页码:7 / 10
页数:4
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