Electrical behaviour of SiOxNy thin films and correlation with structural defects

被引:7
|
作者
Rebib, F
Tomasella, E
Aida, S
Dubois, M
Cellier, J
Jacquet, M
机构
[1] Univ Clermont Ferrand, Lab Mat Inorgan, UMR 6002, CNRS, F-63177 Aubiere, France
[2] Univ Mentouri, Lab Couches Minces & INterfaces, Constantine 25000, Algeria
关键词
silicon oxynitride; sputtering; electrical properties; structural defects;
D O I
10.1016/j.apsusc.2005.12.129
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Silicon oxynitride thin films were deposited by reactive r.f. sputtering from a silicon target. Different Ar:O-2:N-2 gas atmospheres were used at fixed power density (3.18 W cm(-2)) and pressure (0.4 Pa) to obtain various film composition. Pt-SiOxNy-Pt sandwich type structure was realised for electrical property investigations. The C-V measurements showed the absence of a Schottky barrier and thus confirmed that Pt electrode provides an ohmic contact. The evolution of the current density showed a decrease of the film conductivity when the oxygen concentration in the films increases. The various layer composition leads to two different conduction mechanisms which were identified as space charge limited current (SCLC) and Poole-Frenkel effect. Finally, the structural defects of the films were studied by EPR analysis and the spin densities were correlated to both the composition and the electrical behaviour of the films. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:5607 / 5610
页数:4
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